In other languages Add links. Features Description Documentation Reviews 0. From the best I could figure, the ICs could push enough current only if the temperature is about 80 C, which was the max temperature rating. No registered users and 2 guests.
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NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0, There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Finish options are separated by a vertical ruled line. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
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